no code implementations • 10 Apr 2024 • Tianliang Ma, Guangxi Fan, Xuguang Sun, Zhihui Deng, Kainlu Low, Leilai Shao
This paper proposes a fast system technology co-optimization (STCO) framework that optimizes power, performance, and area (PPA) for next-generation IC design, addressing the challenges and opportunities presented by novel materials and device architectures.
no code implementations • 7 Apr 2024 • Zhihui Deng, Yuanyuan Duan, Leilai Shao, Xiaolei Zhu
Chiplet-based systems, integrating various silicon dies manufactured at different integrated circuit technology nodes on a carrier interposer, have garnered significant attention in recent years due to their cost-effectiveness and competitive performance.
no code implementations • 28 Dec 2023 • Yuanyuan Duan, Xingchen Liu, Zhiping Yu, Hanming Wu, Leilai Shao, Xiaolei Zhu
When integrated with our fast thermal evaluation method, RLPlanner achieves an average improvement of 20. 28\% in minimizing the target objective (a combination of wirelength and temperature), within a similar running time, compared to the classic simulated annealing method with HotSpot.
no code implementations • 20 Dec 2023 • Tianliang Ma, Guangxi Fan, Zhihui Deng, Xuguang Sun, Kainlu Low, Leilai Shao
Our model achieves precise predictions, with absolute error $\le$3. 0 ps for WNS, percentage errors $\le$0. 60% for leakage power, and $\le$0. 99% for dynamic power, when compared to golden reference.
no code implementations • 1 Aug 2023 • Guangxi Fan, Leilai Shao, Kain Lu Low
An innovative methodology that leverages artificial intelligence (AI) and graph representation for semiconductor device encoding in TCAD device simulation is proposed.